Ultra-high peel strength; excellent flex resistance; uniform and dense red oxide film with low powder shedding and high cleanliness; uniform roughened layer thickness with no missed areas, localized thickening, or significant color variation; firmly bonded copper nodules with minimal powder shedding during die-cutting, etching, and lamination; excellent high-temperature oxidation resistance; excellent etching performance compatible with fine-line circuitry; thin film layer that does not compromise the base material's inherent flexibility. Applications: FPC/FCCL flexible circuits, LED flexible light strips, backlight flexible boards, consumer electronics foldable screens, cameras, watch wearable flexible circuits, multilayer FCCL substrates; new energy vehicles, power battery CCS integrated busbar FPC, on-board center control screens, headlight driver FPC, seat sensor flexible circuits, low-voltage electronic control shielding flexible boards; energy storage battery cluster sampling FPC, photovoltaic flexible busbar circuits; industrial control equipment flexible cables, internal flexible conductive circuits for instruments, flexible light strip substrates; medium and low-frequency equipment shielding pads, simple internal shielding layers for inverters.